Substrate Size

  Upto 300 X 160

  Die Size

  Upto 20X20 (Upto 24 X24 available as option)

  Standard FC

  UPH Upto 5000 @ +/- 5um ( For C2/C4 Process)

  MTD with Flux

  UPH Upto 2500 @ +/- 3um (MTD - Melt and Touch Down)

  TCCUF with Flux

  UPH Upto 2000 @ +/- 3um (TCCUF - Thermal Compression - Capillary Underfill)

  TCNCP with Underfill/Paste

  UPH Upto 1500 @ +/- 3um (TCNCP - Thermal Compression - Non Conductive Paste )

  Bond Heater

  Upto 400 Deg C +/-5 Deg C

  Stage Heater

  Upto 120 Deg C +/-5 Deg C

  Pre Heater for Substrate

  Upto 150 Deg C +/-5 Deg C

  Bond Force

  5N - 300N @ 5% or +/- 1N