CONFIGURATIONS

Modular Options to configure to a TCB, TCCUF, MTD or Standard Bonder

 

OPTIONS
QUADPRO STD QUADPRO MTD QUADPRO TCB
1X Wafer Handling System 1X Wafer Handling System 1X Wafer Handling System
1X Die Handling System 1X Die Handling System 1X Die Handling System
1X Substrate Handling System 1X Substrate Handling System 1X Substrate Handling System
2X Bond Module 2X Bond Module 2X Bond Module
4X Bondhead 4X Thermal Bondhead 4X Thermal Bondhead
  1X Cooling System 1X Cooling System
    2X Head Dispensing System
     
Loader-Unloader(Optional) Loader-Unloader(Optional) Loader-Unloader(Optional)